This year at IFA, instead of suddenly finding the new silicon on the show floor, Huawei’s CEO Richard Yu announced this year’s new Kirin 980 during the company’s keynote speech. For readers who’ve been attentively following our articles over the last few months, today’s news should hopefully not come at too big of a surprise, as I’ve been heavily hinting at the timing of the first new 7nm Cortex A76 silicon designs coming later this year in commercial devices, with HiSilicon being the prime candidate for being the first vendor on the market with the their new generation SoC.
Huawei’s silicon design division HiSilicon has been a key strategic component for the company’s products, as it enables it to differentiate itself in a more drastic way than what we usually see from other vendors who simply rely on established open-market SoC vendors such as Qualcomm. This kind of strategy of course is a double-edged sword, as if you’re all-in with your in-house silicon, it also means that these designs must be executed properly, as otherwise you find yourself in an unfavourable competitive position.
The Kirin 950 was an impressive chip as it boasted the first Cortex A72 design on a then new TSMC 16FF manufacturing process – this paid off plenty for Huawei as the combination of new IP as a new manufacturing node resulted in a very competitive silicon which directly translated into favourable characteristics of the handsets in that it was used in.