The last couple of days have been a whirlwind of coverage at two key events: Hot Chips, the semiconductor industry conference regarding new product designs, and some minor thing at Gamescom. At Hot Chips, we have planned to run over a dozen different Live Blogs, and have written up several of the talks into more detailed analysis pieces.
Hot Chips is one of the most enjoyable trade shows I go to every year: in the absence of IDF, Hot Chips is a show where we can learn significant information about both cores in the market, either server or desktop or mobile, or cores that are upcoming in future products. It also gives a chance for some companies to go into more details, or explain how their current products will lead into the future. The other yearly trade show that gives me goosebumps is SuperComputing.
Because we’ve got plenty of content about the show, I just wanted to run a small piece where our readers can access without searching for it. Here is our day one roundup. Day two roundup to follow when day two finishes.
We’ve exclusively first reported on the details of the new microarchitecture back in January and it was clear from that point on that this was a big one: Samsung made a big push in terms of performance, resulting in one of the biggest generational jumps of any silicon CPU designer in recent history. As part of this year’s first conference talks at HotChips 2018, we’ve had the pleasure to finally hear Samsung’s official microarchitecture disclosure on this year’s most polarising new CPU design, the Exynos M3.
Intel and Cascade Lake: Side-Channel Attack Protection
We recently learned about Intel’s Xeon Roadmap at the recent Datacenter Insider Summit, consisting of Cascade Lake in 2018, Cooper Lake in 2019, and Ice Lake in 2020, and now Hot Chips is the first chance for Intel to add some more information to the mix. Previously this would have been done at events like IDF, over several hours, but Intel only has 30 minutes on stage here.